ABOUT ESDM CLUSTER
ESDM cluster offers “State-of-the-art infrastructure and modern-day technological aid along with a testing facility to support the electronics startups ideas.”
The cluster is an initiative of Deshpande Startups in association with the Government of Karnataka & India Electronic and Semiconductor Association (IESA).
It is strategically based in Hubballi, with a vision to promote the ESDM cluster and nurture the young electronics startup community in the North Karnataka region.
ESDM is professionally managed to cater to the Electronics Manufacturing solutions.
It has the capability to serve various verticals includes:
- Consumer Durables
- Power Transmission
- Weighing solutions
- Industry applications product like UPS, Energy Meters etc
What it offers
ESDM Cluster offers Design, Prototype development, Batch production, Final assembly testing facility and Modern day Technological Aids. Deshpande Startups has installed new generation fully Automated SMT facilities with the capability to handle Lead-Free (pb) Processes.
HIGHLIGHTS OF THE FACILITY
- 8500 sq ft of state-of-art hardware manufacturing facility
- ESD protected class 10000 shop floor
- State-of-the-art Lead-free wave-soldering facility for bulk production of PCB assemblies
New generation fully-Automated SMT lines from Fuji
- Fuji solder paste screen printer
- Fuji pick & place machine with tray feeder
- JT RS800II Lead-free reflow oven
Advanced testing and rework facilities consisting of
- Environmental testing chambers
- Vibration testing chambers
- Dust chambers
- Rain test chambers
- Various testing measuring equipment’s like Spectrum analyzer, Logic Analyzer etc
ESDM Cluster Advantages
- Offers a work environment of coherent culture, process & values
- Comprehensive turnkey services under one roof
- Capable of supporting rapid growth and change
- Single-minded focus on quality
- Short lead times and reliable on-time delivery
- 99.9% yield capability
- Strong commitment to supporting customers R&D prototypes
- Lead-Free Process Capability
- 0201 Component Placement
- BGA & Micro BGA Capability
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